Finite element method simulation and performance evaluation of MEMS pressure sensor based on capacitive effect using comsol multiphysics

Abstract

In this final memoire of studies in Master of nanophysics, we discuss and describe the analysis and finite element methods (FEM) simulation of electro-mechanical effects of Micro-electromechanical systems (MEMS) based capacitive pressure sensor with high pressure sensitivity and small size. This model uses the Electro-mechanics interface (EMI) implemented in Comsol Multiphysics software.

This study focuses on the diaphragm deflection, sensitivity and capacitance versus pressure analysis and thermal considerations. Also the simulation results emphasize the importance of considering packaging in the MEMS design process. It also describes comparison of sensitivity of capacitive pressure sensor with and without packaging stress. Specific materials have been used (Molybdenum, Tungsten) in the simulation instead of material Silicon.

Keywords: MEMS, Capacitive Sensors, Comsol Multiphysics, FEM.