Résumé:
In this final memoire of studies in Master of nanophysics, we discuss and describe
the analysis and finite element methods (FEM) simulation of electro-mechanical effects of
Micro-electromechanical systems (MEMS) based capacitive pressure sensor with high
pressure sensitivity and small size. This model uses the Electro-mechanics interface (EMI)
implemented in Comsol Multiphysics software.
This study focuses on the diaphragm deflection, sensitivity and capacitance versus
pressure analysis and thermal considerations. Also the simulation results emphasize the
importance of considering packaging in the MEMS design process. It also describes
comparison of sensitivity of capacitive pressure sensor with and without packaging stress.
Specific materials have been used (Molybdenum, Tungsten) in the simulation instead of
material Silicon.
Keywords:
MEMS, Capacitive Sensors, Comsol Multiphysics, FEM.