Please use this identifier to cite or link to this item:
http://localhost:8080/xmlui/handle/123456789/32215Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Rahn, Armin | - |
| dc.date.accessioned | 2024-11-03T08:44:04Z | - |
| dc.date.available | 2024-11-03T08:44:04Z | - |
| dc.date.issued | 1993 | - |
| dc.identifier.isbn | 0471584711 | - |
| dc.identifier.uri | https://di.univ-blida.dz/jspui/handle/123456789/32215 | - |
| dc.description | XV-396p. :fig.,ill.,tabl. ;24 cm | fr_FR |
| dc.language.iso | en | fr_FR |
| dc.publisher | John Wiley | fr_FR |
| dc.subject | Flectronic packaging | fr_FR |
| dc.subject | Solder and soldering | fr_FR |
| dc.subject | Surface mount kechnology | fr_FR |
| dc.title | The Basics of soldering | fr_FR |
| dc.type | Book | fr_FR |
| Appears in Collections: | Livres | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 2-621-373.pdf | livre | 2,46 MB | Adobe PDF | View/Open |
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