Conception des coupleurs directifs à base de la technologie SIW pour les systèmes de communication mobiles

Abstract

Considering the attractive characteristics of SIW (Substrate Integrated Waveguide) technology in the design of microwave and millimeter components, it becomes a good candidate for the realization of microwave couplers that are easy to integrate with other planar or SIW waveguide-based systems. The work proposed in this thesis is to design completely passive directional couplers in SIW technology which exploits cylindrical metal Vias, intended for integration into planar circuits. The modeling of this passive component is based on the finite element method using the HFSS software. The simulation results obtained show good performance.